Samsung unveils Exynos Modem 5300 to rival Qualcomm, MediaTek

The new modem chip is expected to be used in Google’s next-generation Pixel 8 Series of smartphones

Samsung's 5G telecom modem chip, the Exynos Modem 5300
Samsung's 5G telecom modem chip, the Exynos Modem 5300
Sungsu Bae 1
2023-03-28 21:06:10 baebae@hankyung.com
Korean chipmakers


South Korean tech giant Samsung Electronics Co. has unveiled its latest 5G telecommunications modem, the Exynos Modem 5300, to compete with rivals such as Qualcomm Inc. and Taiwan’s MediaTek Co.

Samsung on Tuesday made official the specifications of the Exynos Modem 5300 made with its advanced 4-nanometer extreme ultraviolet (EUV) lithography technology, improving the chip’s power efficiency and data processing speed.

Samsung, the world’s largest memory chip and smartphone maker, said the new telecommunications chip offers download speeds of up to 10 gigabits per second (Gbps) and upload speeds of 3.5 Gbps on 5G networks.

The Exynos Modem 5300 provides ultra-low latency with support for FR1, FR2 and E-UTRAN New Radio-Dual Connectivity (EN-DC) technology, it said.

Industry sources said the new modem chip is expected to debut on Google’s next-generation Pixel 8 Series of smartphones.

Samsung's Exynos Modem 5300
Samsung's Exynos Modem 5300

With the rapid spread of 5G-enabled devices, the 5G modem market is also growing at a fast pace.

According to research firm Allied Market Research, the global 5G modem market is forecast to grow at an average annual rate of 29.1% to $10.8 billion by 2031 from $843 million in 2021.

Samsung is launching the new chip as it faces an uphill battle against dominant 5G modem player Qualcomm and MediaTek, another strong competitor.

Earlier this month, MediaTek said it has signed a deal to acquire Intel Corp.’s cellular model business.

Samsung, which in 2018 unveiled the Exynos Modem 5100, the world’s first to support 5G multimode devices, has since released a series of new modem chips.

Write to Sungsu Bae at baebae@hankyung.com

In-Soo Nam edited this article.

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